Datalink combined its design engineering, firmware development , and high-reliability CEM capabilities to deliver a complete electronics solution built for endurance and accuracy.

What Datalink did differently:

• Collaborative design: Our multidisciplinary team worked alongside the client’s field engineers to translate sensor performance needs into manufacturable, high-tolerance PCB assemblies.
• Custom electronics architecture: Designed ruggedised signal conditioning and acoustic sensing circuitry to detect micro-changes in sound reflections from pipeline walls, supporting real-time diagnostics.
• Environmental resilience: Used high-grade materials, conformal coatings, and advanced PCB substrates  suitable for sustained high-temperature and high-vibration conditions.
• Integrated datalogging system: Developed a compact, low-power data capture module capable of recording, timestamping, and transmitting diagnostic data with fault tolerance and redundancy.

All processes were validated under AS9100 and ISO 9001  quality frameworks to guarantee compliance, traceability, and long-term reliability.

• Design & Prototyping:
  Datalink’s engineering team created a series of prototype boards integrating analog signal processing, microcontroller-based data capture, and acoustic transducer interfaces.
• Validation & Testing:
  Each design iteration underwent thermal, vibration, and ingress protection (IP) testing  to simulate downhole and rig conditions.
• Process Optimisation:
  Custom manufacturing jigs and automated inspection routines  were developed to maintain repeatability and reduce manual handling.
• Scale-Up to Production:
  Following successful pilot deployment, Datalink transitioned the assemblies into volume production, maintaining full traceability and serialisation for every unit.
• Collaborative Integration:
  Datalink worked closely with the client’s procurement and service teams , providing consistent communication, simplified invoicing, and supply continuity planning.