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- How Datalink Electronics Perfected a New Ceramic PCB Process for Cutting-Edge Augmented Reality Technology
How Datalink Electronics Perfected a New Ceramic PCB Process for Cutting-Edge Augmented Reality Technology
Client Profile / Background
A global technology integrator approached Datalink Electronics to support the development of next-generation augmented reality (AR) headsets designed for advanced field operations. The project demanded exceptional reliability, thermal management, and miniaturisation — all within a tightly controlled, safety-critical supply chain.
As a certified AS9100, ISO 13485, and ISO 9001 organisation, Datalink was selected as the partner of choice for both design and contract electronics manufacturing (CEM) due to its proven expertise in high-reliability, precision electronics for aerospace, defence, and medical applications.
The client needed a new manufacturing process for ceramic printed circuit boards (PCBs) capable of withstanding extreme operating conditions — heat, vibration, and long-term field deployment — without compromising size or weight.
Key challenges included:
- Achieving consistent quality and yield at scale for a novel substrate technology.
- Ensuring thermal and electrical stability for high-performance optics and sensors.
- Establishing a repeatable, certifiable process under stringent regulatory and military standards.
Beyond the technical challenge, there was significant commercial pressure to reduce production costs while scaling from prototype to hundreds of thousands of units rapidly — all while maintaining the traceability and documentation required for AS9100 compliance.
Datalink applied its Design for Manufacture (DfM) and New Product Introduction (NPI) expertise to co-develop and refine a customised ceramic PCB manufacturing process.
Our approach focused on:
- Collaborative engineering: Datalink’s in-house design and manufacturing teams worked closely with the client’s R&D specialists to optimise material selection, via structures, and surface metallisation for performance and cost.
- Precision process control: We introduced advanced temperature and material handling profiles to ensure dimensional stability and improve yields across complex multilayer boards.
- Quality-driven innovation: The process was validated under AS9100 and ISO 13485 standards to ensure traceability and regulatory compliance across the entire build cycle.
This approach not only perfected the process but also established a repeatable production model capable of scaling to full-rate manufacturing.
- Pilot Phase: Initial prototype builds were completed within Datalink’s NPI cell, enabling rapid design iteration and real-time testing feedback.
- Process Validation: Each manufacturing stage — from ceramic substrate preparation to metallisation and inspection — was statistically validated for reliability and repeatability.
- Scale-Up & Production: Once optimised, the process transitioned seamlessly into full production, supported by automated inspection and controlled documentation workflows.
- Partnership Integration: Datalink worked collaboratively with the client’s finance, procurement, and technical teams to simplify supply logistics, introduce single-point invoicing, and provide ongoing engineering support.
The Results / Outcomes
Quantitative Results:
- >200,000 ceramic PCBs manufactured and delivered to date.
- Yield improvement of over 30% through process optimisation.
- Lead time reduction by 25%, accelerating product deployment.
- Zero major non-conformances across multiple audit cycles.
Qualitative Outcomes:
- A trusted, long-term partnership built on transparent communication and continuous improvement.
- Enhanced reputation for manufacturing excellence in advanced AR hardware.
- Established Datalink as a preferred supplier for complex ceramic and hybrid PCB assemblies in high-reliability sectors.
